Product Overview

 

Ultrasonic Technology

Applications

Ultrasonic - Generators:

for drilling, erosion and welding applications at 20 - 120 kHz, with 1 Watt up to 2 kW continuous power

Ultrasonic - Transducers:

for drilling, polishing, ablating and welding up to 2 kW

Ultrasonic - Processing Systems:

manual, CNC/CPC- or PC- controlled systems for 2-3 dimensional processing of brittle materials such as glass, ceramics, gemstones, diamond and PCD

Ultrasonic - Cleaning Devices:

table top and free standing apparatus from 0,5 up to 90 liter volume

 

Laser Technology

Applications

Our Laser Processing Systems consists of integrated Laser Sources,
from Excimer Laser up to frequency converted, diode-pumped Solid-State Laser and newest Fiber-Laser

Excimer-Laser 248 nm, 193 nm

YAG-Laser up to 1 kW

cw, Q-switched and pulsed,

1064-, 532-, 354-, 266 nm

Fiber Laser cw and pulsed

Alexandrite, Nd:YAP, Nd:YLF, Nd:GGG

Er:YAG (2.9 µm), Ho:Tm:Cr (2.1µm)

Laser - Cutting Systems:

for metals, non-metals and diamond. Micro-cuts with minimum 20 micron gap size

Laser - Drilling Systems:

for drilling in metals, non-metals and diamond materials with extreemly smooth drilling surfaces

Laser - Marking:

scanning- and mask-shot marking for metals and other materials, scratching, engraving of metals and non-metals

Laser - Micro Processing Systems:

for drilling and ablating of micro structures smaller than 5 micron by means of special optics and beam bending systems


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